欢迎登录材料期刊网

材料期刊网

高级检索

介绍了非导体表面金属化技术.阐述了化学镀、直接电镀技术Futuron工艺、化学还原、接枝共聚表面处理新技术,并分析了近年来在非导体金属化方面关键技术的改进和发展;介绍了非导体金属化技术的应用领域,并对金属化技术的应用前景进行了探讨.

参考文献

[1] Fan Lianhua;Wong C P.Thermosetting and thermoplastic bisphenol A epoxy/phenoxy resin as encapsulant material[A].Chateau Elan Braselton Georgia:IEEE,2001:230-235.
[2] Gordhanbhai N;Patel;Somerset .pre-swelling and etching of plastics for plating[P].US 4941940,1990-07-17.
[3] Takagi;Susumu;Katayama et al.Pretreatment methods for electroless palting and electrically conductive materials thereby[P].JP 2001-301462,2001-09-28.
[4] Seung-kyun;Ryu Su et al.Plating method of metal film on the surface of polymer[P].US 20030165633A1,2003-09-04.
[5] Kim;Min .Method for forming metal interconnections using electroless plating[P].US 2003040177,2003-02-27.
[6] Takahashi;Koyata .Coating of quartz glass and ceramics parts for semiconductor manufacture by thermal plasma spraying after blasting surface treatment of substrates[P].EP 1310466,2003-05-14.
[7] Honma;Hideo;Kawahara et al.Method of plating nonconductor product[P].JP 2002-JP8655,2002-08-28.
[8] Kenji YAMAGISHI;Shinji YAE;Naoki OKAMOTO .Adsorbates Formed on Non-Conducting Substrates by Two-Step Catalyzation Pretreatment for Electroless Plating[J].表面技術,2003(2):150-154.
[9] Yen Ping-wen;Chou Tse-chuan .Formation of palladium metal active sites on styrene-divinybenzene copolymer catalyst by alcohol reduction at room temperature[J].Applied Catalysis,1999,182(05):217-223.
[10] Tsuru Y.;Mochinaga K.;Ooyagi Y.;Foulkes FR. .Application of vapor-deposited carbon and zinc as a substitute for palladium catalyst in the electroless plating of nickel[J].Surface & Coatings Technology,2003(0):116-119.
[11] 顾朝霞 .ABS及ABS合金的电镀工艺[J].兰化科技,1997,15(01):38-43.
[12] Sekiguchi;Junnosuke;Imori et al.Agent for conducting pretreatment for electroless plating and electroless plating method using the agent[P].JP 2003193245 A2,2003-07-09.
[13] Katayama;Junichi;Maeda et al.Catalyst application on resin substrate before electroless plating[P].JP 2003041375,2003-02-03.
[14] TANAKA;Kenji;Asami et al.Electroless plating of magnesium and magnesium alloy[P].JP 2003231979,2003-08-19.
[15] Yang G.H.;Kang E.T.;Neoh K.G. .Thermal and electroless deposition of copper on poly(tetrafluoroethylene-co-hexafluoropropylene) films modified by surface graft copolymerization[J].IEEE transactions on advanced packaging,2002(3):365-373.
[16] Wu S Y .Surface modification of poly films by graft copolymerization for adhension improvment with evaporated[J].Transactions on Advanced Packaging,1999,22(02):214-220.
[17] 章兆兰;张博 .低温化学镀镍的研究及其应用[J].陕西师范大学学报(自然科学版),1998,26(04):71-73.
[18] 鲍红权;刘强华.化学镀金属导电纤维制备与性能研究[J].玻璃纤维,1997(04):2-5.
[19] 刘国勤,李延祥.Ni-Co-P/SiC镀层和SiC表面金属化[J].腐蚀与防护,2002(09):381-383.
[20] F. Touyeras;J. -Y. Hihn;M. -L. Doche;X. Roizard .Electroless copper coating of epoxide plates in an ultrasonic field[J].Ultrasonics sonochemistry,2001(3):285-290.
[21] 陈亚 .高品质塑料电镀技术新进展[J].电镀与环保,1999,19(03):3-5.
[22] 宋玉苏,姚树人.涂层与基体金属附着力的研究进展[J].材料保护,1999(09):21-22.
[23] Huang Chuen-Jung;Yen Chih-chao;Chang The-chou et al.Studies on the preparation and properties of conductive polymers Ⅳ. novel method to prepare metallized plastics from metal chelates of polyamides[J].Application of Polymer Science,1991,42(08):2267-2277.
[24] Yen Chih-chao;Chang The-chou .Studies on the preparation and properties of conductive polymer. Ⅰ. novel method to prepare metalized plastic from metal chelate of poly (vinyl alcohol)[J].Application of Polymer Science,1990,40(01):53-66.
[25] Toriyama;Naoki (Japan) .Electroless plating by reducing metal ion on substrate surface[P].JP 2002363762,2002-12-18.
[26] 刘光炳,湛虹.金属化的高分子薄膜制备与导电性能[J].材料保护,1998(06):3.
[27] 敖辽辉 .高精度碳纤维复合材料天线金属化技术[J].电讯技术,1999,39(02):84-86.
[28] 夏文干;杨洁.先进复合材料金属化研究的必要性探讨[J].电讯工程,2001(01):17-26.
[29] 吴利英,高建军,靳武刚.复合材料转移法金属化脱模剂工艺研究及应用[J].胶体与聚合物,2001(04):21-22.
[30] Klein;Rita J (USA) .Electroplating and electroless plating of metal in the manufacture of programmable RAM device[P].US 2003052330,2003-03-20.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%