讨论了电解铜箔镀镍工艺,并对镀镍后铜箔的一些性能进行了测试,通过与镀锌电解铜箔的一些性能比较,发现镀镍电解铜箔解决了镀锌电解铜箔存在的一些弊端,尤其是提高了电解铜箔的耐化学腐蚀性以及在对由镀镍电解铜箔制成的覆铜箔板进行蚀刻时明显地减少了侧蚀现象.
参考文献
[1] | 葛菁.PCB用铜箔市场现状与展望[J].印制电路信息,2001(02) |
[2] | 朱祖泽;贺家齐.现代铜冶金学[M].北京:科学出版社,2002:586-588. |
[3] | Circuit Foil Corporation .Copper foil having improved bond strength[P].US 1211494,1968-02-06. |
[4] | Takahashi Mitsuo;Kawasumi Yoshio .Surface treating process for copper foil for use in printed circuit[P].US 4131517,1978-12-26. |
[5] | Hiroshi Nakatsugawa .Nieckl plated copper foil for a printed circuit[P].GB 2073778,1981-05-18. |
[6] | Torday;Jone Mcglly;James .Treatment of copper foil[P].EP 0112635,1984-04-07. |
[7] | Sang-kyum Kim;Chang-Hee Choi .Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil[P].US 0121789,2003-07-03. |
[8] | Wolski Adam M;Cheng Chintsai T;Simon Richard B .Treatment for copper foil[P].US 4572768,1985-06-28. |
[9] | GB/T 5230-2000.GB/T 5230-2000.电解铜箔[S]. |
[10] | Yates C;Woski A .Copper foil treatment and products produced therefrom[P].US 3857681,1974-12-06. |
[11] | 章葆澄.电镀工艺学[M].北京:北京航空航天大学出版社,1993:57-98. |
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