锡镀层锡须生长的快速评估计算方法

1.飞思卡尔半导体(中国)有限公司,天津300381

2.飞思卡尔半导体(中国)有限公司,天津300381

3.飞思卡尔半导体(中国)有限公司,天津300381

4.飞思卡尔半导体(中国)有限公司,天津300381

Quick Evaluation and Calculation Method for Whisker Growth on Tin Coating

通过锡须指数的计算及对高低温循环实验条件下锡须生长情况的观察与测量,建立了锡须指数与锡须生长长度之间的关系,使得可以在高低温实验结果出来之前就能借助锡须指数来评估锡须生长的风险,从而使实时评估控制镀锡电镀生产线变为可能.

[1]	Kadesch J S;Leidecker H .Effect of conformal coat on tin-whisker growth[R].,2000.
[2]	B-Z.Lee;D.N.Lee .Spontaneous growth mechanism of tin whiskers[J].Acta materialia,1998(10):3701-3714.
[3]	Peng Su;Min Ding;Chopin S .Effects of reflow on the microstructure and whisker growth propensity of Sn finish[J].Electronic Components and Technology Conference,2005,1(55):434-440.
[4]	Zhao J.-H.;Su P.;Ding M.;Chopin S.;Ho P. S. .Microstructure-Based Stress Modeling of Tin Whisker Growth[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2006(4):265-273.

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