在甲醛化学镀铜镀液中加入离子液体1-乙基-3-甲基咪唑四氟硼酸盐,研究了对化学镀铜的影响.结果表明,随着离子液体质量浓度的增大,化学镀铜溶液的沉积速率降低,铜层晶粒细化,电阻增加.环境扫描电镜和X-射线衍射观察测试表明,镀层表面分布均匀,且在铜(111)晶面成核的趋势增加.电化学测试表明,随着离子液体质量浓度的增大,阳极氧化峰电位负移,氧化峰电流密度减小,进一步显示ρ(1-乙基-3-甲基咪唑四氟硼酸盐)对甲醛化学镀铜溶液沉积速率有抑制作用.
参考文献
[1] | Isao Shitanda;Atsushi Sato;Masayuki Itagaki;Kunihiro Watanabe;Nobuyuki Koura .Electroless plating of aluminum using diisobutyl aluminum hydride as liquid reducing agent in room-temperature ionic liquid[J].Electrochimica Acta,2009(24):5889-5893. |
[2] | Abbott AP;Nandhra S;Postlethwaite S;Smith EL;Ryder KS .Electroless deposition of metallic silver from a choline chloride-based ionic liquid: a study using acoustic impedance spectroscopy, SEM and atomic force microscopy[J].Physical chemistry chemical physics: PCCP,2007(28):3735-3743. |
[3] | Y.S.Chen;J.C.Lin;Z.H.Lin .Effect of Solvent on the Morphology of Nickel Localized Electrochemical Deposition[J].Journal of the Electrochemical Society,2011(5):D264-D268. |
[4] | Jonathan G. Huddleston;Heather D. Willauer;Richard P. Swatloski;Ann E. Visser;Robin D. Rogers .Room temperature ionic liquids as novel media for 'clean' liquid-liquid extraction[J].Chemical communications,1998(16):1765-1766. |
[5] | Jiang H Y;Liu Z J;Wang X W et al.Effect of triethanolamine on deposition rate of electroless copper plating[J].Transactions of the Institute of Metal Finishing,2007,85(02):103-106. |
[6] | 杨志锋,高彦磊,李娜,王旭,殷列,王增林.超级化学镀铜填充微道沟的研究[J].化学学报,2009(24):2798-2802. |
[7] | Yang Z F;Wang Z X;Wang X et al.Comparison of bottom-up filling in electroless plating with an addition of PEG,PPG and EPE[J].Chinese Journal of Chemistry,2011,29:422-426. |
[8] | Xu Wang;Na Li;Zhifeng Yang;Zenglin Wang .Effects of Triethanolamine and K_4[Fe(CN)_6] upon Electroless Copper Plating[J].Journal of the Electrochemical Society,2010(9):D500-D502. |
[9] | Yang, Z.;Li, N.;Wang, X.;Wang, Z.;Wang, Z. .Bottom-up filling in electroless plating with an addition of PEG-PPG triblock copolymers[J].Electrochemical and solid-state letters,2010(7):D47-D49. |
[10] | Shu-Ling Ko;Jeng-Yu Lin;Yung-Yun Wang;Chi-Chao Wan .Effect of the molecular weight of polyethylene glycol as single additive in copper deposition for interconnect metallization[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2008(15):5046-5051. |
[11] | Wei Wang;Ya-Bing Li;Yong-Lei Li .Invalidating Mechanism Of Bis (3-sulfopropyl) Disulfide (sps) During Copper Via-filling Process[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2009(8):4389-4392. |
[12] | Wang X;Yang Z F;Li N et al.First synergy effects of SPS and PEG-4000 on the bottom-up filling in electroless copper plating[J].Journal of the Electrochemical Society,2010,15:546-549. |
[13] | Lin YM.;Yen SC. .Effects of additives and chelating agents on electroless copper plating[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2001(1/4):116-126. |
[14] | Milan Paunovic;Russ Arndt .The effect of some additives on electroless copper deposition[J].Journal of the Electrochemical Society,1983,130(04):794-799. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%