阐述了国内外不同铅合金的各种电镀液的研究现状.重点阐述了铅-锡合金镀液、铅-银合金镀液、铅-锡-锑巴氏合金镀液、各种铅复合沉积镀液等的组成及性能特点.指出了镀铅及铅合金电解液存在的问题,并对未来铅合金电镀液的发展趋势进行了展望.
参考文献
| [1] | 屠振密.电镀合金原理与工艺[M].北京:国防工业出版社,1995:393-442. |
| [2] | 蔡倩.甲烷磺酸盐电镀锡-铅合金工艺[J].汽车工艺与材料,1999(01):16-18. |
| [3] | R.Balaji,Malathy Pushpavanam,罗慧梅.甲基磺酸在电镀相关金属精饰领域的应用[J].电镀与涂饰,2004(05):40-45. |
| [4] | Kim J-H;Suh M-S;Kwon H-S .Effects of plating conditions on theMicrostructure of 80Sn-20Pb electrodeposits from an organic sulphonate bath[J].Surface and Coatings Technology,1996,78(01):56-63. |
| [5] | Neveu B;Lallemand F;Poupon G;Mekhalif Z .Electrodeposition of Pb-free Sn alloys in pulsed current[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2006(10):3561-3573. |
| [6] | L.C.Prasad;A.Mikula .Role of surface properties on the wettability of Sn-Pb-Bi solder alloys[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,1999(1/2):279-285. |
| [7] | 周卫铭,郭忠诚,龙晋明,徐瑞东.电镀铅锡锑巴氏合金[J].机械工程材料,2005(01):27-29. |
| [8] | 王丽丽.锡-铜-铋合金电镀液[J].电镀与精饰,2004(02):38-41. |
| [9] | 胡德意,李职模,曾垂海,钟建武,何旭开.甲磺酸电镀光亮锡-铅-铋合金工艺研究[J].电镀与精饰,2003(06):8-11. |
| [10] | Ostrow B D;Nobel F I;Yoen L .Electrodeposition of tin,lead and tin/alloys[P].US:4000047,1976-12-28. |
| [11] | Nobel F I;Ostrow B D .Bath and process for electroplating tin,lead and tin/alloys[P].US:4701244,1987-10-27. |
| [12] | 吴水清 .镀铅锡合金添加剂的研究进展[J].表面技术,1999,28(02):1-5. |
| [13] | 钱倚剑;李文娜.磺酸盐溶液中的铅锡合金电镀研究[J].化工腐蚀与防护,1995(03):12-17. |
| [14] | 邵奇临.柠檬酸型电镀光亮铅锡合金工艺与添加剂的改进[J].材料保护,1996(09):30. |
| [15] | 覃奇贤.柠檬酸-EDTA电镀光亮Sn-Pb合金的研究（Ⅰ）工艺研究[J].电镀与精饰,1995(03):4. |
| [16] | 廖小珍,陶蓉,蒋春宝.烷基磺酸盐电镀锡铅合金工艺影响因素的研究[J].电镀与涂饰,2000(01):36-38. |
| [17] | Hirsch S;Rosenstein C .Tin,lead,and tin-lead plating[J].Met Finish Guidcb-Dir,2001,99(1A):308-319. |
| [18] | Proell W A .Electrodepositing bath and process[P].US:2525942,1950-10-17. |
| [19] | Nobel F I;Ostrow B;Schram D N .Bath and process for platingtin,lead and tin-lead alloys[P].US:4565609,1986-01-21. |
| [20] | Thomson D;Luke D A;Mosher C .Reducing tin sludge in acid tin plating[P].US:5378347,1995-01-03. |
| [21] | Toben M P;Brown N D;Esterl D J et al.High speed tin,lead or tin/lead alloy electroplating[P].US:4994155,1991-02-19. |
| [22] | 王森林,张雁.甲磺酸中Pb-Sb合金的电沉积及其电化学性能[J].应用化学,2008(11):1324-1329. |
| [23] | 李国斌,令玉林.甲基磺酸体系电镀铅锡合金工艺的研究[J].材料保护,2006(03):29-31. |
| [24] | A. Hrussanova;L. Mirkova;Ts. Dobrev .Anodic behaviour of the Pb-Co_3O_4 composite coating in copper electrowinning[J].Hydrometallurgy,2001(3):199-213. |
| [25] | 冯灿辉;陈文亮;康志苹 .氟硅酸盐体系电沉积铅镉合金的研究[J].电镀与涂饰,1992,11(03):1-6. |
| [26] | Eyre D;Gabe D R;Eastham D R .Electrodeposition of Cd-Pb Alloys:Part-Ⅰ Fluosilicate Electrolytes[J].Transactions of the Institute of Metal Finishing,1984,62(01):113-116. |
| [27] | Eyre D;Gabe D R;Eastham D R .Electrodeposition of Cd-Pb Alloys:PartⅠ-ISulphamate and Citrate-Acetate Electrolytes[J].Transactions of the Institute of Metal Finishing,1985,63(01):22-26. |
| [28] | Eyre D;Gabe D R;Eastham D R .Electrodeposition of Cd-Pb Alloys:Fluoborate Electrolytes[J].Plating and Surface Finishing,1985,72(04):74-80. |
| [29] | 朱瑞安;郭振常.脉冲电镀[M].北京:电子工业出版社,1986:1-36. |
| [30] | 李则林.组合添加剂对铅-锌合金共沉积的作用[J].厦门大学学报,1996(03):379. |
| [31] | 李则林.铅-锌合金电沉积工艺研究[J].材料保护,1995(11):9. |
| [32] | H. Saloniemi;T. Kanniainen;M. Ritala;M. Leskela .Electrodeposition of PbTe thin films[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1998(1/2):78-82. |
| [33] | Feng Xiao;Bongyoung Yoo;Margaret A. Ryan;Kyu-Hwan Lee;Nosang V. Myung .Electrodeposition of PbTe thin films from acidic nitrate baths[J].Electrochimica Acta,2006(3):1101-1107. |
| [34] | Heini Saloniemi;Marianna Kemell;Mikko Ritala;Markku Leskela .Electrochemical quartz crystal microbalance study on cyclic electrodeposition of PbS thin-films[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2001(1):32-40. |
| [35] | 黄子勋;吴纯素.电镀理论[M].北京:中国农业机械出版社,1982:56-57. |
| [36] | 黄新民,吴玉程,张勇.电镀Sn-Pb-In合金研究[J].电镀与涂饰,1999(03):37-39. |
| [37] | 薛伯生.轴瓦电镀Pu-Sn-Cu三元合金工艺的优化[J].电镀与环保,2000(01):8-10. |
| [38] | 罗序燕,李东林.铜线材氟硼酸盐高速电镀光亮锡铅及锡铅钴合金[J].表面技术,2004(04):67-68. |
| [39] | 潘君益,郭忠诚,朱晓云,耿卫东.电沉积制备Pb-WC-ZrO2复合镀层的工艺及性能研究[J].电镀与涂饰,2005(08):1-4. |
| [40] | 姚金江 .电沉积法制备Al/Pb/PbO2复合阳极材料的新技术研究[D].昆明:昆明理工大学,2008. |
| [41] | 谢香兰 .脉冲电沉积制备Ti基铅复合阳极材料及性能的研究[D].昆明:昆明理工大学,2010. |
| [42] | 武剑 .Al/Pb/WC/CeO2和Al/α-PbO2/β-PbO2电极的脉冲电沉积制备及电化学性能研究[D].昆明:昆明理工大学,2011. |
| [43] | 李渊,蒋良兴,倪恒发,吕晓军,赖延清,李劼,刘业翔.锌电积用Pb/Pb-MnO2复合电催化阳极的制备及性能[J].中国有色金属学报,2010(12):2357-2365. |
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