欢迎登录材料期刊网

材料期刊网

高级检索

在次磷酸钠化学镀镍溶液中研究共同添加3-巯基丙烷磺酸钠和聚乙烯亚胺-5000对化学镀镍的影响,通过线性扫描伏安法研究了添加剂对阳极、阴极极化曲线的影响.结果表明,随着3-巯基丙烷磺酸钠浓度的增加,化学镀镍平均速率增大,当ρ(3-巯基丙烷磺酸钠)达到5mg/L时镀镍平均沉积速率达到最大,在此溶液中继续添加聚乙烯亚胺-5000,发现沉积速率下降,且比单独添加聚乙烯亚胺-5000还小.利用3-巯基丙烷磺酸钠对化学镀镍的加速作用和聚乙烯亚胺-5000的抑制作用,以及其在溶液中低的扩散系数,成功实现了化学镍的完全协同填充.

参考文献

[1] Romankiw L T .A Path:From Electroplating Through Lithographic Masks in Electronics to LIGA in MEMS[J].Electrochimica Acta,1997,42:2985-3005.
[2] Tetsuya Osaka .Electrodeposition of highly functional thin films for magnetic recording devices of the next century[J].Electrochimica Acta,2000(20):3311-3321.
[3] Tomohiro Okada;Hisashi Kimura;Isao Nunokawa;Nobuo Yoshida;Kimitoshi Etoh;Moriaki Fuyama .Fabricating Narrow and Trapezoidal Main Poles for Single-Pole-Type Heads[J].IEEE Transactions on Magnetics,2004(4 Pt.2):2329-2331.
[4] E. I. Cooper;C. Bonhote;J. Heidmann;Y. Hsu;P. Kern;J. W. Lam;Ramasubramanian;N. Robertson;L. T. Romankiw;H. Xu .Recent developments in high-moment electroplated materials for recording heads[J].IBM journal of research and development,2005(1):103-126.
[5] Mohammadreza Baghbanan;Uwe Erb;Gino Palumbo .Towards the application of nanocrystalline metals in MEMS[J].Physica Status Solidi, A. Applied Research,2006(6):1259-1264.
[6] Wolfgang Ehrfeld .Electrochemistry and microsystems[J].Electrochimica Acta,2003(20/22):2857-2868.
[7] Iyer D;Palaparti D;Podlaha E J et al.Thermal Expansion of Electrodeposited Nanoscale Multilayers of Invar with Copper[J].Electrochem Solid-StateLett,2006,9:C88-C91.
[8] S.-K. Kim;J. E. Bonevich;D. Josell .Electrodeposition of Ni in Submicrometer Trenches[J].Journal of the Electrochemical Society,2007(9):D443-D451.
[9] Chang Hwa Lee;John E. Bonevich;Ugo Bertocci .Superconformal Ni Electrodeposition Using 2-Mercaptobenzimidazole[J].Journal of the Electrochemical Society,2011(6):D366-D376.
[10] Shingubara S;Wang Z L;Yaegashi O.Bottom-Up Fill of Copper in High Aspect Ratio Via Holes by Electroless Plating[A].
[11] Zenglin Wang;Osamu Yaegashi;Hiroyuki Sakaue .Bottom-Up Fill for Submicrometer Copper Via Holes of ULSIs by Electroless Plating[J].Journal of the Electrochemical Society,2004(12):C781-C785.
[12] Zenglin Wang;Ryo Obata;Hiroyuki Sakaue;Takayuki Takahagi;Shoso Shingubara .Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating[J].Electrochimica Acta,2006(12):2442-2446.
[13] Yang Z F;Wang Z X;Wang Z L et al.Comparison of Bottom-Up Filling in Electroless Plating with an Addition of PEG,PPG and EPE[J].Chin J Chem,2011,29(03):422-426.
[14] Zhifeng Yang;Xu Wang;Na Li;Zhixiang Wang;Zenglin Wang .Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches[J].Electrochimica Acta,2011(9):3317-3321.
[15] 杨志锋,高彦磊,李娜,王旭,殷列,王增林.超级化学镀铜填充微道沟的研究[J].化学学报,2009(24):2798-2802.
[16] Xu Wang;Zhifeng Yang;Na Li;Zonghuai Liu;Zupei Yang;Zenglin Wang .First Synergy Effects of SPS and PEG-4000 on the Bottom-Up Filling in Electroless Copper Plating[J].Journal of the Electrochemical Society,2010(10):D546-D549.
[17] Zan, L.;Liu, Z.;Yang, Z.;Wang, Z. .A synergy effect of 2-MBT and PE-3650 on the bottom-up filling in electroless copper plating[J].Electrochemical and solid-state letters,2011(12):D107-D109.
[18] Zan L X;Liu Z H;Yang Z P et al.Achievement of Bottom-Up Electroless Nickel Filling on the SiO2 Surface with Pd-Activated SAM[J].ECS Electrochemistry Letter,2013,2(01):D1-D3.
[19] T. P. Moffat;J. E. Bonevich .Superconformal Electrodeposition of Copper in 500-90 nm Features[J].Journal of the Electrochemical Society,2000(12):4524-4535.
[20] Premratn Taephaisitphongse;Yang Cao;Alan C. West .Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition[J].Journal of the Electrochemical Society,2001(7):C492-C497.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%