采用电沉积的方法获得了高硬度铜镀层,考察了镀层的形貌、硬度以及热振性能,并对其进行了晶相分析与晶粒尺寸计算.结果表明,由于镀层中晶粒尺寸减少,晶粒排列更加紧密,导致镀层硬度大大提高.这种高硬度、低热阻的特性很好的解决了LED散热的问题,延长了LED灯的使用寿命.
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