研究了活性填料钽(Ta)在聚碳硅烷(PCS)先驱体转化陶瓷中的应用.研究表明,活性填料Ta能有效降低陶瓷素坯的气孔率.Ta可与PCS气态裂解产物和N2气氛反应生成新的化合物,提高PCS的陶瓷产率.Ta还能提高烧成体的强度.但是Ta的引入并不能抑制坯体在裂解过程中的收缩.Ta含量越高,陶瓷烧成体的线收缩越大.
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