研究了Ni-Cu-P化学镀液主要成分、PH值、温度以及时间等工艺参数对化学沉积Ni-Cu-P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数，得到了Cu含量从0到56.18wt%的Ni-Cu-P合金镀层。利用EDS和XRD研究了镀液中硫酸铜浓度对Ni-Cu-P合金镀层组织结构的影响。在硫酸铜浓度低于3g/L时，Ni-Cu-P合金镀层中P含量高于7.05wt%，合金镀层是非晶态结构。
The effects of the deposition parameters such as bath composition, PH, temperature and time on the element contents and deposition rate of the electroless Ni-Cu-P deposits were studied. The electroless Ni-Cu-P deposits with various copper contents from 0 to 56.18 wt% were prepared through choosing the proper deposition parameters. The effect of copper sulfate concentration in the bathon the microstructure of the electroless Ni-Cu-P deposits was studied by using EDS and XRD. Ni-Cu-P deposits with phosphorus content more than 7.05wt% were amorphous, in the situation, the copper sulfate concentration in the bath was lower than 3g/L.
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