采用SEM和TEM观测了经热压处理后的Ag/Bi(2223) 带材(Jc＝56000A/cm2,在77K、自场)和只经过室温轧制处理的带材.与室温轧制的带材比较发现:即使在临近第二相的区域,热压处理后的带材结构也非常密实;热压处理后,晶体缺陷诸如裂缝、亚晶界、残余无定形态和中间相等,易阻碍或中断电流传输的缺陷显著减少;热压处理后带材的位错密度基本相同,但在某些区域分布不均匀或呈网状结构;在一定方向上晶界能捕获途经它的位错;热压过程促使第二相部分转变为超导相Bi(2223),进而提高带材的载流能力.
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