作为结构陶瓷的新型连接剂,有机硅树脂在连接过程中需要经过低温交联和高温裂解.本工作综合表征和研究了有机硅树脂YR3370的交联和裂解过程,认为低温交联可以合理控制有机硅树脂的粘度,有机硅树脂YR3184的高温裂解产物是具有共价键网络结构的无定形SixOyCz陶瓷,通过与陶瓷基体之间的共价键键合,无定形SixOyCz陶瓷起到无机粘接剂的作用.此外,硅烷偶联剂有助于有机硅树脂的交联与裂解.
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