以4,4'-二胺基二苯醚(ODA)和3,3',4,4'-二苯醚四酸二酐(ODPA)为单体,采用两步法,分别经热亚胺化和化学亚胺化过程制备了两种聚酰亚胺(PI)薄膜,并对两种薄膜的性能进行了表征.傅立叶红外光谱(FT-IR)表明两种薄膜均已完全亚胺化.化学亚胺化的PI薄膜的玻璃化温度、热稳定性均高于热亚胺化的薄膜.拉伸性能测试表明热亚胺化的薄膜具有较高的断裂伸长率,而化学亚胺化的薄膜的拉伸强度、弹性模量较大.
参考文献
| [1] | 刘习奎,顾宜.用于挠性印制电路基板的低热膨胀系数聚酰亚胺研究进展[J].材料导报,2001(12):46-48. |
| [2] | 张雯,张露,李家利,张凯.国外聚酰亚胺薄膜概况及其应用进展[J].绝缘材料,2001(02):21-23. |
| [3] | 丁孟贤;何天白.聚酰亚胺新型材料[M].北京:科学出版社,1998 |
| [4] | Kailani MH.;Sung CSP. .Chemical imidization study by spectroscopic techniques. 1. Model amic acids[J].Macromolecules,1998(17):5771-5778. |
| [5] | Kailani MH.;Sung CSP. .Chemical imidization study by spectroscopic techniques. 2. Polyamic acids[J].Macromolecules,1998(17):5779-5784. |
| [6] | MOHAMMED H K;CHONG S P S;SAMUEL J H .Syntheses and characterization of model Imide compounds and chemical imidization study[J].Macromolecules,1992,25:3751-3757. |
| [7] | PRYDE C A .IR Studies of Polyimides I effects of chemical and physical changes during cure[J].Journal of Polymer Science Part A:Polymer Chemistry,1989,27:711-754. |
| [8] | KEREUZ J A;ENDREY A L .Studies of thermal cyclizations of polyamic acids and tertiary amine salts[J].Journal of Polymer Science Part A:Polymer Chemistry,1966,4:2607-2616. |
| [9] | SNYDER R W .FTIR studies of polyimides:thermal curing[J].Macromolecules,1989,22:4166-4172. |
| [10] | 黄培,耿洪斌,程茹,王晓东,时钧.长链聚酰胺酸的热环化动力学[J].高分子学报,2004(02):256-262. |
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