采用直流磁控溅射方法,在SiC颗粒表面成功地沉积了金属铜膜.利用场发射扫描电子显微镜(FESEM)、能谱仪(EDS)和电感耦合等离子体发射光谱仪(ICP-AES)等测试仪器对其表面形貌和组份进行了表征.重点讨论了不同的沉积条件对薄膜结晶的影响,并用X射线衍射仪(XRD)对其进行了表征.结果表明,溅射镀膜时,通过控制SiC颗粒的运动方式,可以在其表面镀上均匀、连续和致密的金属膜.溅射时间越长或溅射功率越大或温度越高,都有利于薄膜结晶.
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