Sn-Ag-Cu-Ce钎料润湿性能及焊点力学性能研究

材料工程, 2008, (9): 5-8. doi: 10.3969/j.issn.1001-4381.2008.09.002

Sn-Ag-Cu-Ce钎料润湿性能及焊点力学性能研究

王俭辛 ^1, , 薛松柏 ^2, , 韩宗杰 ^3, , 禹胜林 ^4, , 陈燕 ^5,

1.南京航空航天大学,材料科学与技术学院,南京,210016

2.南京航空航天大学,材料科学与技术学院,南京,210016

3.南京航空航天大学,材料科学与技术学院,南京,210016

4.南京航空航天大学,材料科学与技术学院,南京,210016;中国电子科技集团公司,第14研究所,南京,210013

5.哈尔滨焊接研究所,哈尔滨,150080

关键词：无铅钎料 , 润湿性能 , 力学性能

Study on Wettability of Sn-Ag-Cu-Ce Solder and Mechanical Properties of Soldered Joints

基于润湿平衡原理研究了微量稀土元素Ce对Sn-Ag-Cu-Ce无铅钎料在Cu基板上润湿性能的影响规律,研究了Sn-Ag-Cu-Ce焊点的力学性能及断口形貌.结果表明,随着稀土Ce含量的增加,钎料在Cu基板上的润湿时间逐渐缩短,润湿角逐渐减小,当Ce的质量分数在0.03%～0.05%时,Sn-Ag-Cu-Ce钎料的润湿性能较好.且当Ce的含量为0.03%左右时,Sn-Ag-Cu-Ce焊点的力学性能达到最佳值,焊点断口呈现均匀的韧窝形貌,断裂方式以韧性断裂为主.

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材料期刊网

Sn-Ag-Cu-Ce钎料润湿性能及焊点力学性能研究

Study on Wettability of Sn-Ag-Cu-Ce Solder and Mechanical Properties of Soldered Joints

参考文献