热处理对Ni-P镀层结构及硬度的影响

材料工程, 2010, (11): 48-51. doi: 10.3969/j.issn.1001-4381.2010.11.012

热处理对Ni-P镀层结构及硬度的影响

程延海 ^1, , 朱真才 ^2, , 韩正铜 ^3, , 邹勇 ^4,

1.中国矿业大学,机电工程学院,江苏,徐州,221116

2.中国矿业大学,机电工程学院,江苏,徐州,221116

3.中国矿业大学,机电工程学院,江苏,徐州,221116

4.山东大学,热科学与工程研究中心,济南,250061

基金项目: 中国矿业大学青年科研基金(2009A016) 国家自然科学基金(51006117) 江苏省博士后基金(0902003C) 中国博士后基金(20090461152)

关键词：化学镀Ni-P , 微观结构 , 硬度

Effect of Heat Treatment on the Structure and Hardness of the Electroless Ni-P Deposits

采用化学镀的方法,在低碳钢基体上制备了纳米相含量不同的镀层.镀层在氩气保护下,分别经200,400℃保温1h进行热处理.采用电子探针(EPMA)、XRD射线衍射以及维氏硬度计研究了镀层热处理前后结构及硬度的变化.结果表明,随着纳米相含量的增多,镀层由非晶逐渐变为纳米晶,而硬度相应变大.200℃保温1h热处理,非晶与混晶镀层由于少量析出物Ni3P的出现使得硬度增大,而纳米晶镀层由于发生了弛豫使得镀层硬度降低.400℃保温1h热处理时,试样均发生了晶化,析出弥撒的Ni3P金属间化合物以及Ni相,纳米晶镀层的Ni相峰值强度增大最多,而非晶镀层所对应的Ni相峰值强度增大较少.然而,经400℃保温1h热处理后,非晶镀层硬度增大最多,这归因于非晶镀层析出的Ni3P金属间化合物数量多于混晶以及纳米晶镀层.

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