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利用ε-己内酯的酶促开环聚合,合成了α-羟基,ω-环氧基聚己内酯低聚物( ETPCL);利用—OH与—NCO的亲核加成反应,通过聚氨酯途径合成了环氧基封端的聚己内酯接枝环氧树脂共聚物(PCL-g-GY250);将PCL-g-GY250与分子量较高的环氧树脂GT7071进行共混,通过胺类固化剂与环氧基团的固化反应制备了不同PCL-g-GY250含量的环氧树脂复合体系(PCL-g-GY250/GT7071);利用热失重分析(TGA)及在甲苯中的溶胀实验分别对复合体系的耐热性能和交联密度进行了表征.结果表明:随PCL-g-GY250含量的增加,体系的交联网络密度逐渐下降;PCL-g-GY250的引入,使得复合体系的耐温性能得到改善:当PCL-g-GY250与GT7071的质量比为4∶1时,固化体系的5%热失重温度(T5%d)可由纯环氧固化体系的145.0℃提高到216.3℃;尤其是纯PCL-g-GY250固化体系的T5%d更是达到293.9℃,相比纯环氧树脂固化体系提高了148.9℃.

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