纯铜表面预镀Ni,随后采用料浆包渗法,以SiO2粉为Si源,纯Al粉为还原剂,NaF和NH4Cl作为复合活化剂,Al2O3为惰性添加剂,蛋白质(鸡蛋清)为黏结剂,在Cu表面预先镀Ni层随后料浆包渗制备渗层.研究了包渗温度对渗Si层组织和力学性能的影响.结果表明:随包渗温度的增加,渗层组织出现以下转变:Ni31 Si12→Ni31 Si12+Ni2Si→Ni31 Si12+Ni2 Si+NiAl,包渗过程由渗Si为主转变为Si-Al为主；渗层硬度降低；摩擦因数由750℃时的0.17增加到950℃时的0.33.
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