本文从理论上分析了纳米填料在电子封装用导电胶中的作用.从纳米填料含量、粒径、形状与维度、表面状态、固化温度与固化时间等方面综述了纳米填料导电胶性能影响因素的国内外研究进展;重点介绍了纳米填料原位生成、纳米填料烧结等导电胶性能改进技术,探讨了存在的主要问题,并指出进一步提高导电导热性能、粘接强度和可靠性,制备应用于柔性封装、喷墨印刷的导电胶以及降低制备成本是未来纳米填料导电胶研究领域的发展方向.
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