在聚芳基乙炔树脂(PAA)中分别加入笼型八苯基硅倍半氧烷(OPS)、笼型八氨基苯基硅倍半氧烷(OAPS)和笼型八炔丙基胺苯基硅倍半氧烷(OPAPS)对其进行改性.利用SEM、XRD、红外、DSC和TGA对PAA/POSS体系进行了相容性和热性能的研究.SEM图及XRD结果表明,OPS与PAA相容性差,OAPS次之;由于OPAPS中端炔基可参与PAA的固化反应,因此OPAPS与PAA相容性最好.红外光谱分析结果表明炔基固化反应后主要生成共轭烯和芳环结构,PAA/POSS的复合物中,POSS的笼型结构得以保留.DSC结果表明POSS的加入使得体系放热量有所减少,且OPAPS的加入使体系放热峰向高温区稍有偏移.TGA结果表明OAPS或OPAPS的引入可以基本保持PAA固化产物原有的热稳定性.
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