通过电子背散射衍射(EBSD)技术和取向成像显微(OIM)技术对经过不同工艺处理的含硅3%硅钢样品织构和晶界特征分布(GBCD)进行研究.结果表明:在所有样品中,∑1晶界在低∑CSL晶界中所占比例最高,立方取向晶粒之间构成∑1晶界;∑13b和∑29a随着立方取向晶粒增多而增多,尤其是∑13h更为明显;对于各取向晶粒相当的试样,∑1晶界最多,∑3、∑5、∑7、∑9、∑11、∑15晶界比例接近.
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