利用直流脉冲电场下产生的非平衡等离子态的氢对CuO进行了强化还原实验,考察等离子体的固有化学特性对还原过程的影响.在体系压力450Pa、温度200℃的条件下,分子态的氢不能还原CuO,而等离子态的氢可还原CuO得到金属Cu.随着还原时间的增加,等离子态的氢还原CuO得到金属Cu层厚度的变化随着试样放置方式的不同呈现不同的规律,等离子体鞘层的变化对还原速率有很重要的影响.还原层厚度随时间的变化可以分为三个阶段,前两个阶段的反应速率主要受制于到达氧化物表面氢活性粒子流的通量,活泼的等离子体氢在反应产物层向反应界面的扩散是第三阶段的速率限制性环节.
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