采用环氧化聚倍半硅氧烷(glycidyl POSS)对自制低分子量聚苯醚环氧树脂共混物进行改性得到纳米复合材料,研究了POSS对复合材料的介电性能、耐热性能和相结构的影响.当POSS含量在3～15phr时,复合材料的介电常数在3.45～3.70(1MHz)间,介电损耗正切在0.0098～0.0119间,相对于基体材料明显降低.热机械分析(TMA)表明,POSS的加入提高了基体材料的玻璃化转变温度,当含有15phr POSS时,玻璃化转变温度升高了18.8℃.热失重分析表明,POSS提高了基体材料的初始热分解温度、统计耐热系数和最终残炭量.扫描电子显微镜(SEM)分析表明,POSS粒子降低了聚苯醚分散相的尺寸,促进了聚苯醚和环氧树脂的相容.
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