为提高电沉积镀层质量和自动化程度,开发了新型的自动化电刷镀技术。利用扫描电镜、X 射线衍射仪、透射电镜、X 射线应力测试仪、数显显微硬度计和显微磨损试验机考察了不同电流密度下制备的电刷镀 Ni 镀层的组织结构和性能,并与电镀 Watts Ni对比。结果表明,应用电刷镀制备的镍镀层组织平整致密,无针孔、麻点等缺陷；随着电流密度从4A/dm2增加到16A/dm2,电刷镀Ni镀层的(111)面择优取向逐渐降低,(200)面择优取向逐渐增加,镀层的晶粒尺寸和应力逐渐增大,硬度约在500~600HV之间波动,镀层磨损失重由6.8mg降低到5.2mg。
A new automatic brush electroplating technology was developed to improve the quality and automatic level of electro-deposition.Effect of current density on microstructure and properties of automatic brush elec-troplating nickel were investigated by SEM,XRD,TEM,X-ray stress tester,micro hardness tester and CE-TR,and the plating was compared with Watts Ni plated.The results show that automatic brush electroplated nickel has compact and smooth microstructure,without pinholes and nodules etc.defect.With current density from 4A/dm2 increase to 16A/dm2,the degree of (111)preferential orientation decreases and that of (200) preferential orientation increases by degrees;the grain size and internal stress gradually increases;the micro-hardness fluctuate in 500-600HV,and the loss weight from 6.8 to 5.2mg.
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