随着电子器件等对有效散热的需求日益迫切，石墨烯基界面导热材料由于其优异的热性能成为近年来研究的热点。综述了石墨烯基界面导热材料的组成成分，介绍了其热导率的预测模型和测定方法。并且结合热导率模型，分析了填料本质导热性、填料添加量及其在基体中的分布、界面耦合强度等因素对其导热性的影响。最后，对其今后的研究和发展进行了分析和展望。
With the continual increase demand in efficient heat dissipation for the electronic devices,graphene-based thermal interface materials has became a heated topic because of the excellent thermal properties in recent years.This paper provides a comprehensive review of the composition of graphene-based thermal interface ma-terial,the prediction model and test method of the thermal conductivity.And according to thermal conductivity model,the influencing factors of thermal conductivity were analysized,such as the intrinsic thermal conductivi-ty of filler,filler volume fraction and its distribution in the matrix,the interface coupling strength.Finally,the future research and development were analyzed and prospected.
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