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随着LED(light emitting diode)器件功率的增大,造成结温升高并导致LED器件可靠性和使用寿命明显降低.因此开发高效、低成本,且可靠性高的散热技术与散热材料已成为大功率LED器件研发领域的一个重要研究方向.从LED芯片结构设计、辅助散热装置及封装散热材料的设计与选用这3个方面对大功率LED器件的散热技术与散热材料研究进展进行了综述.

参考文献

[1] Bai Kun;Nie Qiuhua;Wu ligang et al.Heat dissipation optimization of high-power white LED lamp[J].Journal China Illuminating Engineering,2012,2(23):52-56.
[2] Adam Christensen;Samuel Graham .Thermal effects in packaging high power light emitting diode arrays[J].Applied thermal engineering: Design, processes, equipment, economics,2009(2/3):364-371.
[3] Narendran N.;Gu Y. .Life of LED-based white light sources[J].Journal of display technology,2005(1):167-171.
[4] Narendran N;Gu Y;Freyssinier JP;Yu H;Deng L .Solid-state lighting: failure analysis of white LEDs[J].Journal of Crystal Growth,2004(3/4):449-456.
[5] 钱可元,郑代顺,罗毅.GaN基功率型LED芯片散热性能测试与分析[J].半导体光电,2006(03):236-239.
[6] 苏达,王德苗.大功率LED散热封装技术研究[J].中国照明电器,2007(07):1-3.
[7] Chu J T;Kuo H C;Kao C C et al.Fabrication of p-side down GaN vertical light emitting diodes on copper substrates by laser lift-off[J].Physical Status Solidi,2004,10(01):2413-1416.
[8] 彭晖,朱立秋.LED芯片技术发展趋势[C].第三届国际新光源&新能源论坛论文集,2009:139-150.
[9] Acikalin T;Garimella S V;Petroski J.Optimal design of miniature piezoelectric fans for cooling light emitting diodes[A].New York,2004:663-671.
[10] Ma H K;Chen B R;Lan H W.Study of an LED device with vibrating piezoelectric fins[A].CA,2009:267-272.
[11] Luo X B;Liu S .A microjet array cooling system for thermal management of high-brightness LEDs[J].IEEE Transactions on Advanced Packaging,2007,30(03):475-484.
[12] 吕家东.一种新的LED制冷方案--微通道致冷器[J].光源与照明,2007(01):28-30.
[13] Yuan L L;Liu S;Chen M X.Thermal analysis of high power LED array packaging with microchannel cooler[A].上海,2006:1-5.
[14] 罗小兵,刘胜,江小平,程婷.基于微喷射流的高功率LED散热方案的数值和实验研究[J].中国科学E辑,2007(09):1194-1204.
[15] Sheng Liu;Jianghui Yang;Zhiyin Gan;Xiaobing Luo .Structural optimization of a microjet based cooling system for high power LEDs[J].International Journal of Thermal Sciences,2008(8):1086-1095.
[16] Kim L;Choi JH;Jang SH;Shin MW .Thermal analysis of LED array system with heat pipe[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,2007(1/2):21-25.
[17] SheuGJ;Hwn FS;Tu S H.The heat dissipation performance of LED applied a MHP[A].San Diego,California,USA,2005:1-8.
[18] Lu, Xiang-you;Hua, Tse-Chao;Liu, Mei-jing;Cheng, Yuan-xia .Thermal analysis of loop heat pipe used for high-power LED[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,2009(1/2):25-29.
[19] 陈明祥,罗小兵,马泽涛,刘胜.大功率白光LED封装设计与研究进展[J].半导体光电,2006(06):653-658.
[20] 殷录桥,李清华,张建华.提高大功率LED散热和出光封装材料的研究[J].半导体技术,2008(04):281-285.
[21] 李华平,柴广跃,彭文达,牛憨笨.大功率LED的封装及其散热基板研究[J].半导体光电,2007(01):47-50.
[22] 田大垒,关荣锋,王杏.新型封装材料与大功率LED封装热管理[J].电子元件与材料,2007(08):5-7,19.
[23] 黄磊,陈洪林.LED照明散热研究进展[J].广州化工,2012(08):26-30.
[24] Jonathan H. Harris .Sintered aluminum nitride ceramics for high-power electronic applications[J].JOM,1998(6):56-60.
[25] Miyashiro F.;Iwase N. .High thermal conductivity aluminum nitride ceramic substrates and packages[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(2):313-319.
[26] 王超,彭超群,王日初,余琨,李超.AlN陶瓷基板材料的典型性能及其制备技术[J].中国有色金属学报,2007(11):1729-1738.
[27] Wu Yin;Zhou Heping;Miao Weiguo .A manufacture process for substrate using tape-casting formation[J].Electron Compon Mater,1996,15(01):20-23.
[28] 石功奇;王健;丁培道.高导热氮化铝基片材料的研究现状[J].硅酸盐通报,1993(02):37-42.
[29] Rao B.S.;Hemambar Ch.;Pathak A.V.;Patel K.J.;Rodel J.;Jayaram V. .Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2006(1):58-63.
[30] Jin-Woo Park;Young-Bok Yoon;Sang-Hyun Shin;Sang-Hyun Choi .Joint structure in high brightness light emitting diode (HB LED) packages[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1/2):357-361.
[31] Hu X J;Jiang L N;Goodson K E.Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions[A].Los Angeles,California,USA,2004:98-103.
[32] Jong S. Kim;Won S. Choi;Dongwook Kim;Andrei Shkel;Chin C. Lee .Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2007(1/2):101-107.
[33] Huang J C;Chu Y P;Wei M et al.Comparison of epoxy resins for applications in light emitting diodes[J].Advances in Polymer Technology,2004,23(04):298-306.
[34] Daniel L. Barton;Marek Osinski;Piotr Perlin;Petr G. Eliseev;Jinhyun Lee .Single-quantum well InGaN green light emitting diode degradation under high electrical stress[J].Microelectronics and reliability,1999(8):1219-1227.
[35] 李元庆,杨洋,付绍云.LED封装用透明环氧树脂的改性[J].合成树脂及塑料,2007(03):13-16.
[36] 吴启保,青双桂,熊陶,王芳,吕维忠,罗仲宽.大功率LED器件封装材料的研究现状[J].化工技术与开发,2009(02):15-17.
[37] Yeong-Her Lin;Jiun Pyng You;Yuan-Chang Lin;Nguyen T. Tran;Frank G. Shi .Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2010(4):761-766.
[38] 张宇,王炎伟,张利萍,林祥坚.功率型LED封装用有机硅材料的研究进展[J].有机硅材料,2011(03):199-203.
[39] 陈智栋,邓雪爽,彭银波,金小凤,许娟.发光二极管(LED) 封装用高折射率有机硅树脂的合成[J].化工新型材料,2010(11):49-52.
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