通过抛光剂打磨、碱液清洗或电晕放电处理的不同前处理工艺,对 ABS 树脂表面进行预处理,然后采用自组装技术在不同前处理的 ABS 树脂表面制备6-(3-三乙氧基硅基丙基)氨-1,3,5-三嗪-2,4-二硫醇单钠盐(TES)薄膜,进行了化学镀铜研究。借助接触角测量仪、扫描电子显微镜(SEM)、粘结性测试等对不同前处理后的 ABS 树脂表面状态和化学镀铜后的表面相貌进行了表征。结果表明,与碱液清洗和打磨处理后的ABS树脂表面相比,电晕放电处理后的ABS树脂表面接触角为46.3°,亲水性良好,有利于 ABS树脂表面三嗪二硫醇硅烷自组装膜的形成。化学镀铜后结果显示,打磨处理后的ABS树脂表面形成的铜层均匀性较差且铜颗粒较大；碱处理后的表面制备的铜层致密均匀,但易脱落；电晕处理后的表面铜层致密均匀,铜颗粒较小且与基底连接性好。
The ABS resin surface was pretreated by polishing agent,alkaline liquor or corona discharge technolo-gy in this study.Then 6-(3-(triethoxysilyl)propyl)amino-1,3,5-triazine-2,4-dithiol monosodium (TES)was used to fabricate self-assembled film on different pretreated ABS resin surface.The electroless copperplating was conducted on these pretreated ABS resin plates.The wettability of the ABS surface after pretreatment was evaluated by contact angle,and the morphologies of the ABS surface after electroless copperplating are studied by SEM.The adhesion properties between different pretreated ABS substrates and copperplating are tested by ruling method.The results indicated that the ABS surface pretreated by corona discharge had good wettability compared with polishing agent and alkaline liquor pretreatment,and the contact angle was 46.3°.The SEM im-ages suggested that the porous morphology appeared on the corona treated ABS surface,and the surface rough-ness increased.The copperplating on ABS surface pretreated by corona discharge was uniform and denser,and the copper particle was smaller.The adhesion property between the corona treated ABS substrate and copper-plating was greatly improved.
参考文献
| [1] | Middeke H J .Plating on plastics part Ⅳ-electroless metal deposition[J].电镀与涂饰,2005,24:35-39. |
| [2] | 樊新民;车剑飞.工程塑料及其应用[M].北京:机械工业出版社,2006 |
| [3] | 孙盾,何建平,周建华,杨少华,王涛,狄志勇,朱建龙,赵军,薛花娟.ABS塑料电镀的高锰酸钾前处理工艺[J].材料保护,2009(12):35-37. |
| [4] | 余晓皎,张洵亚,范薇,余中.ABS塑料化学镀铜工艺[J].电镀与涂饰,2007(05):10-12. |
| [5] | Li, ZX;Li, N;Yin, L;He, Y;Wang, ZL .An Environment-Friendly Surface Pretreatment of ABS Resin Prior to Electroless Plating[J].Electrochemical and solid-state letters,2009(12):D92-D95. |
| [6] | Alexandre Garcia;Thomas Berthelot;Pascal Viel .Microscopic Study of a Ligand Induced Electroless Plating Process onto Polymers[J].ACS applied materials & interfaces,2010(11):3043-3051. |
| [7] | 李瑞海,高亚娟,顾宜.ABS表面化学镀表面改性新方法的研究[J].塑料工业,2008(07):66-68. |
| [8] | Yamamoto Y;Nishihara H;Aramaki K et al.Self-as-sembled layers of alkanethiols on copper for protection against corrosion[J].Eletrochemical Society,1993,140:436-443. |
| [9] | 王芳,张海宁,王静,樊瑞彬,李彦妮.杂环有机硅烷自组装膜为载体的ABS树脂表面镀铜[J].材料科学与工程学报,2012(05):698-701. |
| [10] | Kumar A;Biebuyck H A;Abbott N L et al.The use of self-assembled monolayers and a selective etch to gener-ate patterned gold features[J].Journal of the American Chemical Society,1992,114:9188-9189. |
| [11] | Nuzzo R G;Dubois L H;Allara D L .Fundamental studies of microscopic wetting on organic surfaces.1. Formation and structural characterization of a self-con-sistent series of polyfunctional organic monolayers[J].Journal of the American Chemical Society,1990,112:558-569. |
| [12] | Wang F;Li Y N;Wang Y et al.Self-assembled mono-layer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit[J].Nanoscale Res Lett,2011,6:483-487. |
| [13] | 朱绒霞.ABS塑料化学镀铜实验[J].大学化学,2011(03):68-69. |
| [14] | 舒畅,谢光荣,朱有兰.ABS塑料电镀全套前处理工艺[J].材料保护,2010(09):59-60. |
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