随着我国电子技术的不断发展，对于电子封装材料的要求不断提高，作为新一代电子封装材料的金刚石颗粒增强金属基复合材料由于具备优异的热物理性能和良好的机械性能，受到了广泛的关注。就金刚石增强金属基复合材料的研究进程进行了总结，并列举了国内外研究者们在金刚石增强金属基复合材料方面所取得的进展。包括针对复合材料界面优化所采用的金属基体合金化、金刚石表面金属化以及先进制备技术的开发。并且总结了复合材料导热理论研究中所提出的理论和模型。最后，对于金刚石颗粒增强金属基高导热复合材料的进一步研究方向提出了展望。
With the rapid development of electric technology,the electronic packing materials need to possess higher thermal properties and suitable mechanical properties to dissipate the heat generated in electronic devices. As the new generation of electronic packing materials,diamond dispersed metal matrix composites with superi-or thermal properties and suitable mechanical properties have drawn much attention.This paper has summarized the research progress of diamond dispersed metal matrix composites.Such as metal matrix alloying,diamond surface metallization and advanced produce techniques which have been used to improve the interface between reinforcement particles and metal matrix.Also,the physical models and theories that used to stimulate the thermal properties of composites were discussed.Finally,some advice about the future investigate topic of the diamond dispersed metal matrix composites were listed in this paper.
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