对高体积分数 SiCp/Al 复合材料进行前处理,再化学镀镍。研究了除油、粗化、活化对 SiCp/Al复合材料化学镀镍的影响。分析了镀镍层的显微组织。结果表明,有机溶剂除油比碱液除油效果好。H2 O2系粗化比 HF 系粗化更为适宜。在由醋酸镍、次亚磷酸钠和乙醇组成的活化剂中室温浸润,然后160℃温度下热还原30 min,化学镀镍镀速较高。前处理后在 SiCp/Al 复合材料表面化学镀镍可沉积上致密、均匀、结合良好的镀镍层。
The high volume fraction SiCp/Al composite was processed by pretreatment,then it was proceeded by electroless nickel plating.The influence of deoiling,roughening,activating on electroless nickel plating on SiCp/Al composite was investigated.The microstructure of electroless nickel plating on composite was ana-lyzed.The results show that organic solvent was better than alkaline solvent for deoiling.H2 O2 system was more appropriate than HF system for roughening.Infiltrating in activation solution consisted nickel acetate,so-dium hypophosphite and alcohol at room temperature,then thermo deoxidizing at 160 ℃ temperature for 30 min,the procedure makes electroless nickel plating rate higher.After pretreatment,electroless nickel plating deposited on SiCp/Al composite surface was dense,uniform,firmly combined.
参考文献
[1] | Molina JM;Narciso J;Weber L;Mortensen A;Louis E .Thermal conductivity of Al-SiC composites with monomodal and bimodal particle size distribution[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(1/2):483-488. |
[2] | J.-M. Molina;M. Rheme;J. Carron .Thermal conductivity of aluminum matrix composites reinforced with mixtures of diamond and SiC particles[J].Scripta materialia,2008(5):393-396. |
[3] | 张建云,孙良新,王磊,华小珍.电子封装SiCp/356Al复合材料制备及热膨胀性能[J].功能材料,2004(04):507-508,512. |
[4] | Cui Yan,Wang Lifeng,Ren Jianyue.Multi-functional SiC/AI Composites for Aerospace Applications[J].中国航空学报(英文版),2008(06):578-584. |
[5] | 樊建中,肖伯律,徐骏,石力开.SiCp/Al复合材料在航空航天领域的应用与发展[J].材料导报,2007(10):98-101. |
[6] | 田大垒,王杏,关荣锋.电子封装用SiCp/Al复合材料的研究现状及展望[J].电子与封装,2007(03):11-15. |
[7] | 李敬勇,赵勇.颗粒增强铝基复合材料的焊接性及其搅拌摩擦焊[J].材料开发与应用,2004(06):30-33. |
[8] | Wang Shaogang;Liu Hongxia .Brazability of SiC particu-late reinforced aluminum matrix composites[J].Journal of Materials Science and Engineering,2009,27(02):186-189. |
[9] | Iudit P;Viktor M;Zoltan G .Arrangement of the Al-Ni phases in Al/SiC(Ni)p composites[J].International Jour-nal of Microstructure and Materials Properties,2012,7(01):49-63. |
[10] | T. N. Tran;G. Yu;B. N. Hu;Z. H. Xie;R. Tang;X. Y. Zhang .Effects of pretreatments of magnesium alloys on direct electroless nickel plating[J].Transactions of the Institute of Metal Finishing: The International Journal for Surface Engineering and Coatings,2012(4):209-214. |
[11] | Suwan P. Mendis;Chin-Che Tin;Michelle T. Tin .Electroless Nickel for n-type Contact on 4H-SiC[J].Materials Science Forum,2012(Pt.2):837-840. |
[12] | 张冬生,张建云,李亚红,周贤良.SiCp/Al复合材料近净成形制备及性能[J].金属热处理,2011(01):49-51. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%