材料期刊网

以麦秸碎料和无机胶粘剂为主要原料,通过冷压成型工艺制备无机麦秸碎料板,研究了胶草比及板材密度对板材性能的影响,并通过 X 射线衍射仪、热重分析仪及扫描电镜等仪器分析了胶草比及板材密度对无机麦秸碎料板性能影响机制。结果表明,胶草比增加,麦秸碎料对无机成分水化反应的“隔阻”效应减弱,水化反应速度加快,反应更完全,结晶更完整,胶凝材料生成量增加,板材 IB 增大,TS 减小,MOR 和MOE先增大后减小。胶草比增大,麦秸碎料在板材中的分布均匀性增加,界面接合性能变好,界面摩擦阻力增大,板材力学性能变好,热稳定性增加。板材密度增加可以促进并加速无机成分水化反应,胶凝材料生成量增加,板材MOR、MOE及IB增大,而 TS减小。密度增大板材密实度增加,无机胶粘剂各晶相颗粒间的相互作用增强,界面摩擦阻力及热运动阻力增大,板材力学性能变好,热稳定性增加。

With wheat straw and inorganic glue as main raw materials,inorganic wheat-straw particleboard was prepared by moulding pressing technology.The effect of glue-straw ratio and density on physical and mechanical properties of inorganic wheat-straw particleboard was studied.X-ray diffraction (XRD),thermogravimetric ana-lyzer (TGA)and scanning electron microscope (SEM)were used to analyze influencing mechanism of a differ-ent level of glue-straw ratio and density of the board.The results show that inhibition effect of wheat straw to hydration reaction of inorganic composition decreases with the increasing glue-straw ratio during board mainte-nance.hydration reaction speed of inorganic composition in inorganic wheat-straw particleboard was increased, and the reaction carries out more completely,produced more complete crystallization and more inorganic glue. IB of inorganic wheat-straw particleboard increases gradually and TS of that decreases gradually;MOR and MOE of that firstly increase and then decrease,wheat straw have a good distribution in the particleboard.Prop-erties of bonding interface between wheat straw and inorganic adhesive became better as well as good mechanical properties were formed,interface friction and thermal stability were increased,hydration reaction speed of inor-ganic composition in inorganic wheat-straw particleboard was increased and produced more inorganic glue with the increase of particleboard density.IB and MOR,MOE of inorganic wheat-straw particleboard increases grad-ually and TS was decreased.The interaction between the crystalline particles were increased,mechanical proper-ties,interface friction and thermal stability were increased too with the increase of particleboard density.