基于物理气相沉积(PVD)之直流磁控溅射镀膜技术在低硅钢薄板双面共沉积富 Si 膜,然后高温真空扩散处理使 Si 渗入低硅钢基体,提高基体含 Si量.以沉积Fe5 Si3膜＋1180℃×1 h 扩散为1回合增Si处理,研究了多回合循环增Si处理过程硅钢基体组织结构与性能的演化机理.采用光学显微镜对样品进行了金相分析,采用扫描电镜(SEM)观察了样品的微观组织形貌,并用能谱分析仪(EDS)进行成分分析.用X射线衍射仪(XRD)和透射电镜(TEM)表征了样品的结构特征.经过4回合循环增 Si 处理可将0．35 mm厚低硅钢基体含 Si 量由3％提高到6．5％,且沿厚度方向 Si 浓度分布均匀.相比于初始态低硅钢基片,PVD法制成6．5％Si 高硅钢中高频铁损值降低40％~50％.
Si-enriched films were deposited by DC magnetron sputtering onto both surfaces of low-Si steel sub-strate with 0.35 mm thickness,subsequent annealing in vacuum at 1 180 ℃×1 h results in penetration of Si into the substrate.The microstructure and Si concentration were investigated by optical microscopy and scanning e-lectron microscopy (SEM)and energy dispersive spectrometer (EDS).The phases were identified by X-ray dif-fractometer (XRD)and transmission electron microscope (TEM).With the increment of Si content by penetra-tion of Si,the substrate still exhibited a-Fe(Si)bcc and the lattice constant decreased slightly.After 4 rounds of the Si-enriched process,the alloys demonstrated uniform distribution of Si with 6.5%.Iron losses of the pre-pared Fe-6.5% Si alloy were declined about 40%-50% comparing with the starting substrate.
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