利用紧凑拉伸实验方法，测定含钆有机玻璃的平面应变断裂韧性 K IC ，并对紧凑拉伸试样的断面形貌进行分析。利用环境扫描电子显微镜原位拉伸测试技术，分析含钆有机玻璃在拉伸应力下的断裂过程，认为用裂尖银纹-裂纹模型和次级破裂模型分别解释含钆有机玻璃的慢速裂纹扩展和快速裂纹扩展过程是合适的。
The plane-strain fracture toughness K IC of Gd3 +-containing organic glass was investigated from the compact tension test,and the fractographs of compact tension specimen on the fracture surfaces was analysed. The fracture process under tensile stress of Gd3 +-containing organic glass has been examined via in situ environ-mental scanning electron microscopy (ESEM).We are convinced that crack-craze model on crack tip for slow crack growth and secondary fracture model for fast crack growth of Gd3 +-containing organic glass may be used to explain all phenomenons which were observed in this experiments.
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