采用光学显微镜、透射电子显微镜(TEM)、维氏硬度仪和万能材料试验机等手段对 C194合金连续挤压全过程的组织演变与性能特征进行研究。结果表明,C194合金连续挤压过程没有出现明显的动态再结晶组织,仅在直角弯曲后变形区观察到少量沿晶界择优析出的不完全动态再结晶细小晶粒;各变形区硬度随变形量的增加由88.7 HV提升至136.1 HV,并在直角弯曲后变形区增长减缓;挤压前后材料抗拉强度由263 MPa提高到476 MPa,延展性则由26.5%降至18.7%;挤压过程中发生第二相析出,析出物呈现尺寸为60~80 nm 的椭球形和尺寸为10~20 nm且弥散分布的微小颗粒两种形貌。
The microstructure and property development of C194 copper alloy obtained by continuous extrusion forming (CEF ) were investigated with methods of optical microscopy, transmission electron microscopy (TEM),micro-Vickers hardness measurement and universal-testing machine.The results indicate that no mas-sive obvious dynamic recrystallization (DRX)structures are found during the whole CEF process,whereas small amount of incomplete DRX grains are found preferentially precipitated along grain boundaries at after-right-angle bending region.With the increment of plastic deformation,hardness of C194 copper alloy rises from 88.7 HV to 136.1 HV,an increasing rate slowdown occurs at after-right-angle bending region.Tensile strength was drastically promoted from 263 MPa to 476 MPa during CEF process while elongation drops from 26.5% to 18.7%.Second-phase precipitate with morphology of ellipsoid measuring 60-80 nm and micro dispersed particles measuring 10-20 nm,respectively,are found during CEF process.
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