采用化学镀铜方法，以SnCl2为敏化剂、银氨溶液为活化剂及甲醛为还原剂，并利用正交实验方法在石墨纤维表面镀铜，成功制备了铜基复合材料用石墨纤维增强体。研究了石墨纤维表面化学镀铜的最优工艺参数。实验结果表明，通过优化的正交试验参数，可以在石墨纤维表面获得质量良好，厚度均一的铜镀层，其最佳工艺参数为15 g CuSO4?5H2 O、30 g EDTA-2Na、10 mL甲醛、温度60℃；实验得到镀铜反应的最佳 pH 值为12．4；制备过程中，气流搅拌方法的引入使得所获镀层稳定性和均匀性更佳。采用优化后的工艺对镀铜后的纤维进行导电性能测试，结果表明纤维电导率大大提升。
By the method of orthogonal experiment for chemical copper plating on the surface of graphite fiber, which SnCl2 were used as sensitizer,silver ammonia solution were used as activator and formaldehyde were used as reductant,the graphite fiber reinforcement for copper matrix composites was successfully achieved.The optimum parameters of electroless copper plating on the surface of graphite fiber was studied.Results show that under the majorizing parameters of orthogonal testing,the well quality and uniform thickness of copper coating on the surface of graphite fiber was obtained.The optimum parameters of the electroless copper plating reaction is 15 g CuSO4 ? 5 H2 O,30 g EDTA - 2 Na,10 mL of formaldehyde,temperature 60 o C.The optimum pH of copper plating reaction is 12.4.During the plating process,air mixing method was used to obtain the better stability and uniform coating.Under the electrical conductivity performance test of copper coated fiber which was made on the optimized process,the results found that the electrical conductivity of fiber was greatly enhanced.
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