二次浸Zn是Al材电镀的前处理工艺.Al材碱蚀不当,将对浸Zn乃至后续的电镀过程产生十分不利的影响.研究了在不同浓度NaOH 碱蚀液中碱蚀粗化后的纯Al基材及随后二次浸Zn层的表面形貌,并考察了Al材表面电镀Cu层的质量.结果表明,当碱蚀液浓度20 g/L,浸渍时间1 min时,Al基材表面形成大而深的腐蚀坑,Al基材晶界处腐蚀尤其严重,浸 Zn 层难以将这些腐蚀坑覆盖.而当碱蚀液浓度5 g/L 时,在相同的浸渍时间下,Al基材表面粗糙度适中,无大而深的腐蚀坑,浸Zn层覆盖率高达95％以上,其表面电镀 Cu 层的质量良好.
Twice zinc dipping is the pretreatment process for electroplating the pure aluminum and alloys.If alka-li erosion of Al is not suitable,it has a negative effect on the zincking,even subsequent electroplating process of the Al substrate.After etching in the NaOH aqueous solutions with different concentrations and secondary zinc dipping,surface morphologies of the pure Al substrates and the Zn layer were observed.And thus,the quality of the Cu plating layer on the Al substrate is also evaluated.The results show that big and deep corrosion holes are formed on the Al substrate surface,especially at the Al boundaries,when etching in the 20 g/L NaOH aqueous solution for 1 min.These holes can not be filled by the Zn deposited particles in the secondary zinc dip-ping process.However,as the concentration of the NaOH solution decreased to 5 g/L,the holes on Al sub-strate surface are smaller and more shallow than the former,when the Al substrate dipping in the solution for the same time.Roughness of the etched surface is modest,which is beneficial to the secondary zinc dipping of the Al substrate.The Zn layer has a coverage ratio more than 95%,and the electroplating Cu layer on it is very fine.
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