分别采用真空热压烧结法和压力浸渗法制备了金刚石/Al 复合材料，所得材料的热导率分别达到410~420和673 W/(m?K)。通过传热模型探讨了两种方法制得材料的内部传热机理，并定义了参数“搭桥贡献率”，以量化金刚石颗粒搭桥对材料热导率提升所做的贡献。结果表明，采用压力浸渗工艺时，较高的金刚石含量，较低的界面热阻，尤其是金刚石颗粒搭桥所构成的快速传热通道，可显著提高材料的热导率。
In this paper,diamond/Al composites are prepared via the route of vacuum hot pressing sintering and pressure infiltration,the thermal conductivity (TC)of which reaches 410-420 W/(m?K)and 673 W/(m?K) respectively.Based on the analysis of heat transmission mechanism in the composites,a parameter“contribution rate of diamond bridging”is defined to quantify the contribution of diamond bridging to the increase in TC of the composite.It is shown that the higher TC of the composite prepared by pressure infiltration method can be at-tributed to the following factors:higher volume fraction of diamond particles,lower interfacial thermal resist-ance between diamond/Al,and especially the effect of diamond bridging which constitutes lots of passageways for fast heat transmission.
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