化学镀Ni-P合金中间层可提高Al材表面Cu镀覆性能.采用化学镀工艺,在Al表面沉积均匀连续的Ni-P合金层,再电镀Cu,形成 Al/Ni-P/Cu 复合材料.研究化学镀 Ni-P 合金层的表面形貌,成分及其成膜机理,以及Al/Ni-P/Cu复合材料的结构与电性能.结果表明,Al材经碱蚀前处理后,在其表面形成腐蚀坑或凸起,Ni-P合金在此位置优先沉积,逐渐成膜.碱性镀5 min,酸性镀25 min 后,在 Al 材表面形成厚约5μm 均匀致密的Ni-P合金镀层,再在其表面电镀140μm 厚 Cu 层制备的 Al/Cu 复合材料的电阻率为2．92×10－8Ω.m,经过150℃,360 h热处理后,未发生Al、Cu相互扩散,复合材料的电阻率为3．04×10－8Ω.m,结构与性能十分稳定.
Electrolessplating Ni-P alloy layer can enhance the plating ability of Cu on Al substrate.In this paper, a method for fabricating Al/Cu composite was introduced by electroless plating Ni-P alloy layer followed by e-lectroplating Cu.Planar and cross-sectional morphologies,compositions and formation mechanism of the elec-trolessplating Ni-P alloy layer and microstructure and electrical properties of the Al/Ni-P/Cu composite were investigated.The results show that Ni-P alloy particles are preferentially deposited on corrosion pits and em-bossments on Al surface,and gradually a continuous Ni-P alloy film was formed.A uniform and dense Ni-P al-loy layer of 5μm in thickness was deposited on Al substrate after electroless Ni-P alloy plated in the alkali solu-tion for 5 min and the in the acidic solution for 25 min.After electroplating a thick Cu layer of 140μm in thick-ness,the Al/Ni-P/Cu composite has an electrical resistivity of 2.92×10-8 Ω.m.After heat treated at 150 ℃for 360 h,interdiffusion between Al and Cu is not detected,and electrical resistivity of the Al/Ni-P/Cu com-posite is just 3.04×10-8 Ω.m,indicating that microstructure and electrical resistivity of the composite are ex-tremely steady.
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