随着电路板(PCB)用基材覆铜板技术的不断发展，对覆铜板填料的要求也越来越高。硅微粉作为众多无机填料中的一种，越来越被广泛的使用，其中球形硅微粉与树脂相容性更加，有效提高了覆铜板耐热性。振动磨分级系统被用来生产类球形硅微粉。
With the continuous development of the copper clad laminates(CCL),which is the base material of printed circuit board (PCB),also more and more high requirement to the fillers of CCL.Silicon powder as one kind of inorganic fillers,has been more and more widely used,including spherical silica powder has more com-patibility with resin,improve the heat resistance of the copper clad laminates.Vibration grinding classification system is used to produce kinds of spherical silica powder.
参考文献
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