通过扫描电镜(SEM)、能谱仪(EDS)和电化学站等技术研究了铝合金化学镀Ni-Co-P的"浸锌一闪镀法"和"预植法"两种前处理工艺对镀层的成分、表面形貌和耐腐蚀性能的影响.结果表明,铝合金化学镀Ni-Co-P前处理工艺决定Ni-Co-P镀层的形貌和耐腐蚀性能,对镀层的成分影响不明显;铝合金经"浸锌一闪镀法"前处理工艺处理后化学镀Ni-Co-P所得镀层的镀层耐腐蚀性能下降,并用原子氢-电化学联合理论解释了不同前处理对镀层形貌和耐腐蚀性能影响的原因.
参考文献
| [1] | 胡永俊.熊玲,蒙继龙.钨含量对铝合金化学镀Ni-W-P硬度和耐磨性的影响[J].中国有色金属学报,2007,17(5):737. |
| [2] | Crotty D,Clark B,Greene J,et al.Electroless niekle plating cycle design for thin film memory disks[J].Plating and Surface Finishing,1992,79(2):42. |
| [3] | Valova E,Dille J,Armyanov S,et al.Interface between electroless amorphous Ni-Cu-P coatings and AI substrate[J].Surface and Coatings Technology,2005,190 (2-3):336. |
| [4] | Gao Y,Huang L,Zheng Z J,et al.The influence of cobalt on the corrosion resistance and electromagnetic shielding of electroless Ni-Co-P deposits on AI substrate[J].Applied Surface Science,2007,253 (24):9470. |
| [5] | Hsu J C,Lin K L.Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al[J].Journal of Materials Research,2003,18(9):2221. |
| [6] | Arshed M K M,Abroad I,Jalar A,et al.The surface characteristics of under bump metallurgy (UBM) in electroless nickle immersion gold (ENIG) depositon[J].Miereelectronies Reliability,2006,46:367. |
| [7] | 胡永俊.铝合金预植催化质点诱发沉积镍基合金的研究[D].广州:华南理工大学,2007,38. |
| [8] | 王天旭.化学镀Ni-P镀层生长机理及铝合金化学镀Ni-P和Ni-W-P研究[D].广州:华南理工大学,2006,45. |
| [9] | Corker L,Shyriak I.Electroless Plating Exchange Current Density.Metal Finishing,1996,7:104. |
| [10] | Mencer D.Electroless deposition of amorphous Ni-Re-P alloys from acidic hypophosphite solutions.Journal of Alloys and compounds,2000,306:158. |
| [11] | Saaoudi M,Chassaing E,Cherksoui M,et al.Hydrogen incorporation in Ni-P films prepared by electroless deposition.Journal of Applied Electrochemistry,2002,32:1331. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%