利用动电位极化曲线研究了非晶和铸态的Mg58.5Cu30.5Y11镁合金在0.005 mol/L H2SO4+0.25 mol/L Na2SO4中的电化学腐蚀行为,结果表明:开路电位下两种材料均发生活性溶解,非晶合金由于具有高反应活性,比铸态合金更容易腐蚀;但当外加阳极电位增加至一定数值后,非晶合金的阳极溶解速度低于铸态合金,这是由于非晶合金中溶解到溶液中的Cu重新沉积到合金表面形成了具有保护性能的Cu富集层;铸态合金由多种相组成,不同相之间的电偶腐蚀加速了铸态合金的溶解.
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