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随着电子组装技术的发展和人们对环境日益关注,研制和开发无毒高性能的无铅钎料替代传统的Sn-Pb钎料成为热点.本文综述了无铅钎料使用的必然性和近年来国内外对无铅钎料研究的新进展,并介绍了今后可能的发展趋势.

参考文献

[1] Sungho Jin .Developing lead-free solders:a challenge and opportunity[J].Journal of Mater,1993,45(07):13.
[2] Greg Jones.Are you ready for lead-free assembly?[J].Surface Mount Technology,2000:60.
[3] B ZACCARIA .Filler materials: the current situation and future trends with particular reference to lead-free soldering alloys[J].Welding International,2001(7):545-550.
[4] Bastecki C.Lead-free assembly of mixed-technology PBCs[J].Surface Mount Technology,1997:52-56.
[5] Seelig K;Suraski D.The status of lead-free alloys[J].Circuits Assembly,2000:56-58.
[6] Hwang S.Soldering materials[J].Surface Mount Technology,2002:56.
[7] McCormack M;Jin S .Improved mechanical properties in new Pb-free alloy[J].Journal of Electronic Materials,1994,23(08):715-719.
[8] I.E. Anderson;B.A. Cook;J.L. Harringa .Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties[J].JOM,2002(6):26-29.
[9] Song H G;Morris J W.The creep properties of lead-free solder joints microstructure and properties[J].Journal of Mater,2002:30-32.
[10] Shawkret Ahat;Mei Sheng;Le Luo .Microstructure and Shear Strength Evolution of SnAg/Cu Surface Mount Solder Joint During Aging[J].Journal of Electronic Materials,2001(10):1317-1322.
[11] 曹昱,易丹青,卢斌,杜若昕,王颖.Sn-Ag基无铅焊料的研究与发展[J].四川有色金属,2001(03):5-12.
[12] Xia Zhidong;Chen Zhiguang;Shi Yaowu .Effect of rare element addition on the microstructure and mechanical properties of Tin-Silver-Bismuth Solder[J].Journal of Mater,2002,31(06):564-567.
[13] 赵跃,杜昆,胡咏珍.无铅软钎料的研究[J].广东有色金属学报,1998(02):99.
[14] 郑玉军;张启运 .Sn-In-Zn三原系相图和无铅钎料成分的探讨[J].物理化学学报,1998,14(12):1098-1103.
[15] 史耀武,夏志东,陈志刚,雷永平.电子组装钎料研究的新进展[J].电子工艺技术,2001(04):139-143.
[16] 庄鸿寿.无铅软钎料的新进展[J].电子工艺技术,2001(05):192-196.
[17] J. Glazer .Metallurgy of low temperature Pb-free solders for electronic assembly[J].International Materials Reviews,1995(2):65-93.
[18] Kang S K .Lead(Pb)-free solders for electronic packaging[J].Journal of Electronic Materials,1994,23(08):701-707.
[19] Bath J;Handwerker C;Bradley E.Research update:lead-free solder alternative[J].Circuits Assembly,2000:31-38.
[20] Melton C .The effect of reflow process variables on the wettability of lead-free solders[J].Journal of Mater,1993,45(07):33-35.
[21] McCormack M;Jin S .Progress in the design of new lead-free solder alloys[J].Journal of Mater,1993,45(07):36-40.
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