本文采用无压浸渗法,研究浸渗时间对Al/SiCp陶瓷基复合材料组织、致密度、硬度的影响.浸渗保温时间1h,能浸透,但致密度差,硬度低.保温时间3h,发生粉化现象.结果表明浸渗保温时间2h是无压浸渗较好的工艺参数.
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