溅射沉积由于获得的cBN薄膜颗粒尺寸小、立方相含量高,是cBN薄膜制备技术发展的一个重要方向.本文介绍了溅射沉积过程中的基体负偏压、沉积气氛、沉积温度、靶材功率等工艺参数对cBN薄膜中立方相的含量和薄膜性能的影响规律.并从优化沉积工艺参数、采用过渡层及在膜层中引入其它元素方面介绍了在降低膜层应力方面取得的研究进展.分析归纳出溅射沉积cBN薄膜目前存在的主要问题是薄膜应力过大、存在非立方相氮化硼及B、N原子的比例失配.提出了下一步研究工作的重点是通过深入认识溅射沉积cBN薄膜的的形成机理,优化沉积工艺参数及设计合理的过渡层和新型梯度涂层,以提高立方相的含量、保证B、N原子的比例、降低膜层应力.
参考文献
[1] | 邓福铭,卢学军.我国超硬刀具高速切削技术发展现状、问题及前景[J].硬质合金,2010(04):242-246. |
[2] | 王零森.特种陶瓷[M].长沙:中南大学出版社,2005 |
[3] | 杨杭生,聂安民,张健英.立方氮化硼薄膜的最新研究进展[J].物理学报,2009(02):1364-1370. |
[4] | Wentorf R H .Cubic form of boron nitride[J].Journal of Chemical Physics,1957,26(04):956. |
[5] | Sokolowski M .Deposition of wurtzite type boron nitride layers by reactive pulse plasma crystallization[J].Journal of Crystal Growth,1979,46(01):136-138. |
[6] | 张兴旺,游经碧,陈诺夫.立方氮化硼薄膜制备与性质研究新进展[J].无机材料学报,2007(03):385-390. |
[7] | 吕继磊,满卫东,陈朋,朱金凤,吴飞飞.硬质合金CVD金刚石涂层最新进展[J].硬质合金,2011(05):321-331. |
[8] | 程宇航;吴一平;陈建国 等.立方氮化硼(c-BN)膜的制备、性能及应用[J].材料科学与工程,1996,14(03):6-10. |
[9] | S. Noor Mohammad .Review: Electrical characteristics of thin film cubic boron nitride[J].Solid-State Electronics,2002(2):203-222. |
[10] | Ehrhardt K .New developments in the field of superhard coatings[J].Surface and Coatings Technology,1995,74-75:29-35. |
[11] | 田凌,丁毅,陈浩,刘钧锴,邓金祥,贺德衍,陈光华.用射频溅射法制备立方氮化硼薄膜[J].物理学报,2006(10):5441-5443. |
[12] | Sell K.;Ulrich S.;Nold E.;Ye J.;Leiste H.;Stuber M.;Holleck H. .The constitution and properties of cubic boron nitride thin films: a comparative study on the influence of bombarding ion energy[J].Surface & Coatings Technology,2003(0):1121-1125. |
[13] | Y.M. Chong;K.M. Leung;K.L. Ma .Growing cubic boron nitride films at different temperatures[J].Diamond and Related Materials,2006(4/8):1155-1160. |
[14] | Ulrich, S.;Ye, J.;Stüber, M. .Influence of Ar-N2 gas composition on the magnetron-sputter deposition of cubic boron nitride films[J].Surface & Coatings Technology,2010(S1):S96-S98. |
[15] | J. Ye;S. Ulrich;C. Ziebert;M. Stueber .Stress Reduction Of Cubic Boron Nitride Films By Oxygen Addition[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2008(3):1151-1155. |
[16] | Ding XZ.;Zeng XT.;Xie H. .Cubic boron nitride films deposited by unbalanced RF magnetron sputtering and pulsed DC substrate bias[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2003(1/2):22-27. |
[17] | Roy Clarke;Dmitri Litvinov;Charles Taylor;Darryl Barlett;Aharon Inspektor .Controlling stress in cubic boron nitride coatings[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2001(0):137-141. |
[18] | Ulrich S;Nold E;Sell K;Stuber M;Ye J;Ziebert C .Constitution of thick oxygen-containing cubic boron nitride films[J].Surface & Coatings Technology,2006(22/23):6465-6468. |
[19] | W. Otano-Rivera;R. Messier;L.J. Pilione .Effect of Al additions and A1N interlayers on the stabilization of cBN sputtered thin films[J].Diamond and Related Materials,2004(9):1690-1696. |
[20] | Stein, C.;Keunecke, M.;Bewilogua, K.;Chudoba, T.;K?lker, W.;den Berg, H.V. .Cubic boron nitride based coating systems with different interlayers for cutting inserts[J].Surface & Coatings Technology,2011(S2):S103-S106. |
[21] | Bewilogua K;Keunecke M;Weigel K et al.Growth and characterization of thick cBN coatings on silicon and tool substrates[J].Thin Solid Films,2004,469-470:86-91. |
[22] | J. Ying;X.W. Zhang;Y.M. Fan;H.R. Tan;Z.G. Yin .Effects of silicon incorporation on composition, structure and electric conductivity of cubic boron nitride thin films[J].Diamond and Related Materials,2010(11):1371-1376. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%