采用真空熔炼的方法制备了高强度、高导电的Cu-Ag-Cr和Cu-Ag-Cr-Ce合金,通过显微硬度测试、电导率测试、抗拉强度测试等方法,对这两种合金的性能进行了研究,并探讨了Ce对Cu-Ag-Cr合金性能的影响.结果表明,微量Ce的加入,能够提高Cu-Ag-Cr合金的显微硬度、抗拉强度,改善合金的导电性能;并明显细化Cu-Ag-Cr合金的晶粒;同时抑制合金的再结晶过程,使其再结晶温度相对提高50℃左右.
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