内氧化粉体制备的Ag-SnO2接点材料的显微结构

1.昆明贵金属研究所,中国昆明,650221

2.昆明贵金属研究所,中国昆明,650221

3.昆明贵金属研究所,中国昆明,650221

4.昆明贵金属研究所,中国昆明,650221

5.昆明贵金属研究所,中国昆明,650221

6.昆明贵金属研究所,中国昆明,650221

Microstructure of Ag-SnO2 Contact Material Prepared with Internal Oxidizing Alloy Powder

Ag-Sn-M(M=Bi、Cu)合金粉末内氧化后经压制、烧结、挤压、加工制备成Ag-SnO2接点材料.用光学显微镜,X射线衍射和SEM研究其显微结构.结果表明:在Ag-SnO2材料中存在Ag、SnO2、Bi2SnO7和CuO,氧化物以极细小的颗粒分布在银基体中.

[1]	Schroder K H .Silver-metal oxids a contact materials[J].IEEE Transactions on Components Hybrids and Manufacturing Technology,1987,10(01):127-131.
[2]	Slade P.G.;Chien Y.K. .Switching performance of AgW-Ag(Sn,In)O and AgW-AgSnO/sub 2/ contact pairs[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(1):2-12.
[3]	何纯孝;周月华;王文娜.贵金属合金相图[M].北京:冶金工业出版社,1993:120.
[4]	Hetzmannseder E.;Rieder W. .The influence of bounce parameters on the make erosion of silver/metal-oxide contact materials[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1994(1):8-16.

上一张下一张

计量

作者相关

文章评分