材料期刊网

概括介绍了厚膜金导体浆料。通过改变金粉、粘结剂和有机载体等主要组份的类型和含量，可以制得多种金浆料。①粘结剂类型对厚膜金导体的性能有较大的影响。根据附着机理分类，厚膜金导体分为4种主要类型，即玻璃结合型、反应结合型、混合结合型和表面活化结合型。②金粉颗粒的均匀性、单分散性、表面形态及尺寸对浆料的印刷性能和烧结性能影响大。颗粒表面越光滑，对提高印刷性能越有利。光滑的表面吸附有机载体较少，可减少导体膜在烘干—烧结时的收缩率。③有机载体的含量和流变学性能影响金浆料的印刷性能及烘干—烧结时的收缩率。④金浆中添加起合金化作用的元素，可提高导体在铝丝键合体系及Pb-In焊接体系的热老化性能。⑤为适应新的厚膜工艺技术的需要，研制可光刻的厚膜金导体浆料和金的金属有机浆料［Au MOC］。

Thick-film gold conductor pastes are summarized in this paper.Many kinds of gold pastes are made by changing types and contents of main components such as gold powder,binder and organic vehicle.1.The types of binders deeply affect the characteristics of thick-film gold conductors.Depending on the adhesion mechanisms,thick-film gold conductors are classified into four main types:the fritted-bonded,the reactivity-bonded,the mixed-bonded and the surface activated-bonded systems.2.The homogeneity,monodisperesability,morphology and size of the gold powder particles greatly influence the paste printability and sintering properties.The smoother surface renders the pastes greater printability,and the lower vehicle absorption rate resulting from smooth surface can reduce shrinkage.3.The content and rheology of organic vehicle influence the paste printability and dried-fired shinkage.4.The addition of alloyed elements to gold pastes can improve the thermal-ageing performance in Al-wire bonding and in Pb-In soldering.5.Suiting the needs of new thick-film processes，photo etchable thick-film gold conductor pastes and gold metallo-organic composition［Au MOC］are devoloped.