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用聚乙烯醇作分散剂,抗坏血酸作还原剂,将氯金酸还原到Au;以水合肼作还原剂,将氯铂酸盐还原到Pt,分别制备了Au粉和Pt粉;Au、Pt粉的平均尺寸分别为0.55μm和≈0.08μm.用氧化物和硼硅酸盐作粘结剂配制了1种玻璃粘结、3种混合粘结的浆料.浆料性能测量结果表明,一种性能较好的浆料有:拉伸强度>20N/mm2,烧结后收缩≤0.003mm,片电阻率≤40mΩ/□/25μm,30次浸锡后的溶蚀量为0.062~0.087mm.CuO溶入玻璃改善了化学键,从而提高了附着力.

By using polyvinyl alcohol as disperse agent, Au- and Pt powders were prepared respectively by reduction of chlorauric acid to Au with ascorbic acid and reduction of chloroplatinate to Pt with hydrazine. Average size was 0.55μm for Au- and ≈0.08μm for Pt powder. One glass-, three mixed bonded pastes with Au/Pt ratio of 78/22 were formulated with oxides and borosilicates as binders. The measurement showed that the properties of a better paste were: tensile strength of >20N/mm2, shrinkage after firing of ≤0.003mm, sheet resistivity of ≤40mΩ/□/25μm, and leached amount of 0.062~0.087 mm after dipping 30 times. CuO dissolved into the glass improving chemical bond, consequently, increasing the adhesion.

参考文献

[1] Taylor B E;Getty R R;Henderson J et al.Air and nitrogen-fireable multilayer systems: materials and performance characteristics[J].Solid State Technology,1984,27(03):180-185.
[2] Harper C A.Hand book of Thick Film Microelectronics[M].New York: McGraw-Hill,1974
[3] Yu Shougeng.The application of sintered behavior of gold- and platinum- (or palladium-) powders to thick film microelectronic technology[A].Belgium:IPMI,1987:81-91.
[4] Hitch T T;Bube K R .Basic Adhesion Mechanisms in Thick and Thin Films, Final Report[R].RCA Laboratories,NASC Contract No. N00019-75-C-0145,1976.
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