通过扫描电镜分析,研究了厚膜铂电阻浆料在烘干、烧结过程中微观结构的变化,讨论了烧结过程中对膜层致密度的影响因素.结果表明,烧结温度、烧结制度显著影响膜层微观结构,膜层中出现的针眼状孔洞主要是有机成分挥发、铂粉和玻璃体的拉聚收缩及冷却过程中基体对膜层拉附作用的综合结果.
参考文献
| [1] | Malygin V M .Design of a platinum resistance thermometer temperature measuring transducer and improved accuracy of linearizing the output voltage[J].MEASUREMENT TECHNIQUES,1995,38(01):84-88. |
| [2] | Becher P F;Murday J S .Thick film adherence fracture energy:influence of alumina substrates[J].Journal of Materials Science,1977,12(06):1088-1094. |
| [3] | Sunit Rane;Vijaya Puri;Dinesh Amalnerkar .A study on sintering and microstructure development of fritless silver thick film conductors[J].Journal of Materials Science. Materials in Electronics,2000(9):667-674. |
| [4] | 韦群燕,俞守耕.银膜在玻璃基体上烧结过程的微观结构分析[J].贵金属,2001(02):5-8. |
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