在开发了1种微合金配方的基础上,重点研究了真空熔炼连铸工艺,研制出1种适用于半导体分立器件和集成电路封装的高强度低弧键合金丝.结果表明:1)微合金元素得到有效添加,且分布均匀.2)铸锭组织为粗大柱状晶沿轴向分布.3)机械性能均匀稳定,Φ19 μm:断裂负荷≥5 cN,延伸率2%～6%;Φ15 μm:断裂负荷≥3 cN,延伸率2%～6%.4)与国内外相同规格键合金丝相比,具有更高的强度和更大的熔断电流.
A new kind of gold bonding wires was developed by using new micro-alloy formulae, and the vacuum melting and continuous casting process were also studied. This gold bonding wire's properties included: 1) the micro-alloying elements were added effectively and distributed uniformly, 2) the ingot blank's structure was large columnar grain which was distributed along the axial distribution, 3) the mechanical properties were uniform and steady - Φ19 μm: breaking load ≥ 5 cN, elongation percentage was 2% to 6%; Φ15 μm: breaking load ≥ 3 cN, elongation percentage was 2% to 6%, 4) compared with the same specifications of gold wire for bonding at home and abroad, the new gold bonding wire had high strength and fusing current. This new kind of gold bonding wires is applied to discrete semiconductor devices and integrated circuit package.
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