近10年来甲基磺酸已广泛替代氟硼酸应用于电子设备表面锡焊电沉积领域,其它一些涉及铅的电化学工艺,如贝特工艺电解精炼铅等,目前多采用氟硅酸体系电解液.由于甲基磺酸(MSA)体系电解液在环保方面具有明显优势,越来越多以MSA替代现有电解液方面的研究.另外,市场上部分钢板镀锡工艺也转向采用甲基磺酸镀锡电解液.此外,在镀银、镀镍、镀铜、镀镉及镀锌等领域,MSA的应用市场也在不断发展.本文介绍了甲基磺酸的化学、物理特性,及其在金属精饰方面的应用和优势.
参考文献
[1] | Nobel F I;Point S;Ostrow B et al.Bath and process for plating lead and lead/tin alloys[P].US:4565610,1986-01-21. |
[2] | Nobel F I;Point S;Ostrow B et al.Bath and process for plating tin, lead and tin-lead alloys[P].US:4565609,1986-01-21. |
[3] | Nobel F I;Point S;Ostrow B et al.Process and electrolyte for electroplating tin, lead or tin-lead alloys[P].US:4617097,1986-10-14. |
[4] | Kirk-Othmer.Encyclopedia of Chemical Technology[M].USA:John Wiley and Sons,1997:23. |
[5] | Martin J L;Toben M P.AESF SUR/FIN'88[J].Los Angeles,California,1988:E-3. |
[6] | Proell W .[P].US Patent: 2525493,1950. |
[7] | Paul R C;Kapila V P;Sharma S K.[J].Indian Journal of Chemistry,1974(12):651. |
[8] | Gernon M D;Wu M;Thomas Buszta.[J].Green Chemistry,1999(06):127. |
[9] | Proell W A;Adams C E;Shoemaker B H .[J].Industrial and Engineering Chemistry Research,1948,40:1129. |
[10] | Chen J C .Selective electrolytic stripping of metal coatings from base metal substrates[P].US 4678552,1987-07-07. |
[11] | Hirano S;Oyagi Y;Izaki T .Study of HCD Electroplating by Phenolsulfonic Acid Baths[J].Plating and Surface Finishing,1997,84(07):54. |
[12] | Tam T M .[J].Journal of the Electrochemical Society,1986,133:1792. |
[13] | Smirnov M I;Tyutina K M;Popov A N .[J].Russian Journal of Electrochemistry,1995,31:498. |
[14] | Yau Y H .A Comparative Study of Halogen & Methanesulfonic Acid Electrotinning Process[J].Plating and Surface Finishing,1999,86(08):48. |
[15] | Kunihiro T.;Matsunaga M.;Morimitsu M. .Comparison of platinum with IrO2-Ta2O5 system for the stannous ion consumption in methane sulfonic acid baths with and without catechol[J].Journal of Applied Electrochemistry,2000(3):359-364. |
[16] | Kohl P A .[J].Journal of the Electrochemical Society,1982,129:1196. |
[17] | Deresh L .Low Foaming Solder Plating Electrolytes[J].Metal Finishing,1990,88(01):23. |
[18] | Rinne C L;Hren J J;Fedkiw P S .[J].Journal of the Electrochemical Society,2002,149(03):151. |
[19] | Rosenstein C .Methane Sulfonic Acid as an Electrolyte for Tin,Lead and Tin-Lead Plating for Electronics[J].Metal Finishing,1990,88(01):17. |
[20] | Capelato D;Nobrega J A;Neves F A .[J].Journal of Applied Electrochemistry,1995,25:408. |
[21] | Hsuen W L;Wan C C .[J].Bulletin of Electrochemistry,1990,6(09):790. |
[22] | Lin K L;Hsu K T .Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Bsths[J].Plating and Surface Finishing,2000,87(03):86. |
[23] | Lin Q;Sheppard K G;Datta M et al.[J].Journal of the Electrochemical Society,1992,139:L62. |
[24] | Chin D T;Sunkara M K .Selective Pulse Plating of Gold and Tin-Lead Solder[J].Plating and Surface Finishing,1991,78(02):57. |
[25] | Doss S K .Plating of 60/40 Tin/Lead Solder for Head Termination Metallurgy[J].Plating and Surface Finishing,1997,84(01):38. |
[26] | Jordan M .Lead-Free Tin Alloys as Substitutes for Tin-Lead Alloy Plating[J].Transactions of the Institute of Metal Finishing,1997,75(04):149. |
[27] | Katayama J;Okuno K;Izaki M .[J].Metal Finishing,1996,94(01):12. |
[28] | Kondo T .Bright Tin-Silver Alloy Electrodeposition from an Organic Sulfonate Bath Containing Pyrophosphate, Iodide & Triethanolamine as Chelating Agents[J].Plating and Surface Finishing,1998,85(02):51. |
[29] | Jordan M .Electroplated Lead-Free Tin Alloys for Electronics-Results from Field Tests[J].Transactions of the Institute of Metal Finishing,2002,86(03):97. |
[30] | Huttunen E;Saarivirta .[J].Surface and Coatings Technology,2002,160:288. |
[31] | Huttunen-Saarivirta E;Tiainen T;Lepisto T .[J].Materials Science and Engineering,2002,A336:52. |
[32] | Kondo T;Tetsuya;Masaki S et al.Silver Plating from Silver Methanesulfonate-Potassium Iodide Bath[J].Metal Finishing,1991,89(10):32. |
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