对电沉积制备金属基复合镀层过程中各种工艺参数包括微粒粒径、微粒含量、搅拌强度、镀液pH值、电流密度、温度和表面活性剂类型等因素对镀层中复合微粒含量的影响的研究现状进行了综述.讨论了复合电沉积过程的可能的机理,指出了今后的发展方向.
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